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Technology Ventures

Laser welding technique for joining dissimilar metals without filler materials

Technology #m11-074

This technology is a welding technique that utilizes selective laser irradiation to create strong joints without filler materials.

Unmet Need: Welding technique that creates strong, biocompatible joints

Current methods for joining dissimilar metals typically require filler materials as an interface connector to avoid the formation of a brittle, weak intermetallic region. However, many fillers are not biocompatible, preventing their use in applications such as medical devices. As such, there is a need for welding techniques that can produce strong and biocompatible joints between dissimilar metals.

The Technology: Filler-free, biocompatible technique for joining dissimilar metals

This technology uses selective laser irradiation to join dissimilar metals without using filler materials. A laser beam is used to selectively irradiate one of the metals such that it begins to melt at the interface. The laser is then shut off, and the second metal is brought to the interface to form a high-strength bond. Because the laser can be carefully controlled to avoid melting of both metals, this technology prevents the formation of brittle intermetallic joints without the need of fillers. Compared with current metallic welding methods, this technology is more cost-effective and biocompatible, and can be easily applied to a wide range of industries, including automotive, aerospace, and medical devices.

A prototype of the technology has been tested and shown to create high strength joints.

Applications:

  • Aerospace components
  • Implantable medical devices (e.g., pacemakers, stents, joint/hip replacement implants, etc.)
  • Medical diagnosis instruments
  • Surgical instruments
  • Automobile parts

Advantages:

  • Creates intermetallic joints with high strength
  • Eliminates the need for non-biocompatible filler material
  • Cost-effective
  • Laser parameters are easily tuned to different metals

Lead Inventor:

Y. Lawrence Yao, Ph.D.

Patent Information:

Patent Pending (US 20140008335)

Related Publications:

Tech Ventures Reference: